2019 IEEE Southeastern Michigan Section Spring Conference 🗓 🗺

Webinar Date: Thur, May 2, 2019
Time: 4:00 PM – 7:00 PM (EDT)
Speaker: Doug Patten of DENSO International America, Inc.
Location: 19000 Hubbard Dr, Dearborn, Michigan, United States 48126. Building: U of M Dearborn – Fairlane Center North
Cost: between $25 to $60
RSVP: required
Event Details & Registration: https://events.vtools.ieee.org/m/191793


Registration Fee Schedule:

Early Online Registration ends April 11

Special Request Meal Order Late Registration ends April 25

Day-Of / In-Person Registration Available – Credit Cards Only (No Cash or Checks)

Please register prior to the conference date of May 2.

Conference Attendee Fees: Early / Late

Students/Retired/Unemployed (Members)………$25 / $35

IEEE, SWE, and ESD Members ……………………$45 / $60

Non Members ………………………………………..$60 / $80

Student Table Sponsor (8 students)………………$250

Silver Sponsorship Registration*…………………..$500

Gold Sponsorship Registration*…………………….$1000

Platinum Sponsorship Registration*……………….$2000

Diamond Sponsorship Registration*……………….$3000

Doug Patten Doug Patten of DENSO International America, Inc. Topic: Sustaining The Next Big Thing in the Automotive Industry

While everyone is moving past the automotive industry for the Next Big Thing the current ones have not succeeded yet. Things like automation and electrification still need big things to happen to be sustainable in broad market applications. As we look at the automotive space I will share what has maybe passed and what the Next Big Thing that are still needed.


Doug Patton is Senior Technical advisor at DENSO International America, Inc. (DIAM), and senior director of DENSO Corp. Located at DENSO’s North American headquarters in Southfield, Michigan, he provides input and support on all aspects of R&D in North America. In his previous position as Executive Vice President Engineering and CTO he oversaw all North American product engineering and development, campus facilities and operations including all testing and technical services, and Engineering Administration. He was responsible for climate control, engine components, and systems and components, engine electrical, safety products, cluster, in-vehicle-infotainment (IVI) and body electronics and small motor engineering.

Doug Patton earned a Bachelor of Science degree in Electrical Engineering in 1977 and a Master of Business Administration degree in 1984, both from Bradley University in Peoria, Illinois.

He serves as president of the DENSO Foundation Board, is on the Board of Directors for the Engineering Society of Detroit (currently past president), and is also a member of the SAE, where he was the 2017 president. He is also an Engineering Society of Detroit Fellow.

Doug Patton is a member of the Detroit Economic Club, Lawrence Technological University’s College of Engineering Advisory Board, the Engineering Advisory Council of Kettering University and the Executive Leadership Team of the North American International Powertrain Conference.

Email: Doug-Patton@denso-diam.com

Address:24777 Denso D, , Southfield, Michigan, United States, 48033… Bio

The Hype Behind “AI” 🗓 🗺

Is “Artificial Intelligence” really data “Augmented Intelligence”?

These days – we all collaborate and share massive amounts of data…because that growth was enabled by a massive surge of computing, leading to enable many new applications, once thought of unlikely/impossible or too far away . One of these is the sudden emergence of so called “AI” applications, which was preceded by “Big Data”. In reality, the term “Artificial Intelligence “ is a misnomer or inaccurate representation of what is happening. As such the public needs to know what is the current excitement all about and what it really entails.

This talk will focus on the history, growth, enablement and applications of this new arena and make an attempt to paint perhaps a proper picture of what to expect. Also it will touch upon many other aspects of “AI” and ways to cautiously approach/consider them.

Seminar Date: Thursday, February 28, 2019
Time: 6:00 PM to 7:30 PM (EDT)
Speaker: Sharan Kalwani of IEEE Education Society
Location: Room DH 202, Dodge Hall, 118 Library Drive, Oakland University, Rochester, Michigan 48309-4479, United States of America
Cost: none
RSVP: required
Event Details & Registration: https://events.vtools.ieee.org/m/193569

6:00 PM – Welcome and Introductions
6:00 to 6:15 PM – Pizza, Soda Pop, Social networking
6:15 to 7:15 PM – Technical Talk
7:15 PM to 7:30 PM – Wrap Up

Sharan Kalwani of IEEE Education Society Topic: What is behind all this “AI”?
Email: sharan.kalwani@ieee.org

Sharan Kalwani is currently working as a High Performance Computing (HPC) Specialist and Project Manager. His responsibilities include active participation in several initiatives, help users harness HPC towards solving many of the worlds tough problems. Sharan has a Masters degree from Wayne State University and Bachelors from the University of Delhi. He has nearly 25+ years of experience in major areas of architecture, systems, development, device driver writing, networking, a myriad of several engineering design applications, technical & scientific frameworks, compilers and libraries. He enjoys teaching, history, social media, public speaking and outreach. He has been the 2017-19 Chair Education Society & Vice-Chair of IEEE-CS local Chapter.