Conference Date: 2nd – 4th pf June, 2019
Time: All Day (EDT)
Dr Greg Henderson, SVP Automotive, Communications and Aerospace & Defence Analog Devices, Inc;
Dr IR Michael Peeters, Program Director Connectivity + Humanized technology imec
Location: Boston, Massachusetts
RSVP: required (Registration Opens 4th February, 2019)
Event Details & Registration: https://rfic-ieee.org/
Dear RFIC Community,
I’d like to welcome you to participate in the 2019 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, which will take place 2-4 June 2019 at the Boston Convention and Exhibition Center in Boston, Massachusetts, USA.
The RFIC Symposium kicks off the 2019 IMS microwave conference week with our traditional Sunday workshops followed by two stimulating evening plenary talks. The 2019 Symposium will introduce a new educational activity during the Sunday program, the Technical Lecture. Immediately after the plenary session we will be holding the RFIC interactive Sunday reception that will highlight our industry show-case and student papers finalists for an engaging social and technical evening event. Monday June 3rd and Tuesday June 4th 2019 will be comprised of parallel tracks of technical presentations and thought-provoking lunch-time panel sessions, with special focus around 5G technologies.
Throughout the conference week, you will have the opportunity to meet and discuss ideas with colleagues and speakers. You will expand your network and knowledge of how the latest RFIC technologies will revolutionize wireless communications in the future and impact the life of all of us.
So, whether you are a student seeking for knowledge and attending your first conference, or an active researcher in the academia or industry, or have any interest in the latest about RFIC technologies and circuits, please take advantage of this opportunity!
I look forward to see you at the 2019 RFIC Symposium in Boston, Massachusetts. As the General Chair for 2019 I pledge to deliver the best possible experience to all the attendees.
2019 RFIC General Chair
2019 Plenary Speakers
Dr. Greg Henderson
Senior Vice President
Automotive, Communications and Aerospace & Defense
Analog Devices, Inc.
“The Digital Future of RFICs”
Through significant advances in RFIC technology that have shrunk form factors and price points, high complexity RF, Microwave, and Millimeter wave solutions for communications and sensing are reaching the point of ubiquity. Large, complex multi-antenna and phased array solutions that previously only government organizations could justify have become the basis of modern wireless communications and automotive radar. Cars include millimeter-wave radar technology as a standard feature and 77GHz radar is playing a critical role in the autonomous vehicle revolution. Wireless bandwidth has grown from a trickle to a torrent and high channel count, multi-antenna systems are the key enabler for 5G, whose impact is predicted to extend beyond enabling that torrent of mobile data to revolutionizing industries as varied as agriculture, automotive, healthcare, and industrial.
To date, most of the advances in RFIC technology have largely been driven by the industry moving to high volume advanced geometry CMOS processes and massive increases in system-on-chip integration of complete antenna-to-bits signal chains. Since these are not the most friendly process technologies for traditional RF and microwave circuit blocks, the advances of tomorrow need new RF signal chain and circuit block architectures that exploit the strengths of advanced CMOS processes, while mitigating the disadvantages. This paper will show how such novel architectures and circuit innovations are enabled through leverage of high-performance digital capabilities, resulting in important performance advances that in fact exceed what could be obtained from traditional “RF friendly” process technologies. The paper will show how digitally-assisted-and-enabled RFICs are enabling the future of wireless sensing and communications with real world examples for applications like 5G and automotive radar.
Dr. Greg Henderson was appointed Senior Vice President of Analog Devices’ Automotive, Communications and Aerospace & Defense Group in 2017. Prior to this role, he served as vice president of the RF and Microwave business unit, responsible for the creation and execution of Analog Devices’ strategy for its full suite of RF and microwave products and solutions.
Dr. Henderson has served in leadership roles in the microwave, semiconductor, and wireless communications industry for more than 20 years. He joined Analog Devices as part of the company’s acquisition of Hittite Microwave Corporation, where he served as Vice President of RF and Microwave business units. From 2009 to 2013, Dr. Henderson served as Hittite’s director of broadband products and prior to Hittite, he served as the director of product management, for the Public Safety and Professional Communications Division of Harris Corporation. Prior to Harris Corporation, Dr. Henderson held various management and R&D/product development positions at TriQuint Semiconductor, IBM, and M/A-COM.
Dr. Henderson earned a B.S. in electrical engineering from Texas Tech University and was granted a Ph.D. in electrical engineering from the Georgia Institute of Technology. He holds seven patents in wireless communications and semiconductor technologies and has published more than 20 conference and journal papers.
Dr. Ir. Michael Peeters
Program Director Connectivity+Humanized Technology
“Do the networks of the future care about the materials of the past?”
The traffic in today’s networks, 4G, 5G, mobile or otherwise, seems to be following nicely the exponential expectations projected each year. On the one hand, this is driven by and drives further CMOS scaling for the digital processing of information; on the other hand, this has pushed communication channels to use ever wider bandwidths. Unfortunately, not only the individual endpoint throughputs are increasing, but the amount of endpoints and their capabilities is skyrocketing as well. Moreover, capacity as a KPI is being complemented by reliability and latency as use-cases branch out beyond the traditional human-centric communications and entertainment into e.g. industrial automation, AR/VR and autonomous vehicles.
This is creating a perfect storm at the interface of the analog and digital world, where traditional scaling does not necessarily buy you performance; physical dimensions are dictated not by atom sizes but by quarter-wavelengths of one kind or another; and speeds seem to all be converging at a point where switching frequencies venture far into the super-100GHz territory. For the first time in history, this is true for chip-to-chip, board-to-board, rack-to-rack, datacenter-to-datacenter, fiber and mobile wireless access systems.
Across the design space, this (finally!) has generated renewed interested into solution spaces that are less obvious, or were considered distinctly niche only a couple years ago. We take a look at how we can tackle this, not only from an RFIC circuit design space, but also how new network capacity, reliability and latency requirements can drive technology choices for the next 10 years. This includes novel design and integration options for III-V, more exotic telluride and graphene approaches, but also dielectrics, ceramics and nanostructured materials.
A passionate leader with a background in both research and strategy, Dr. Ir. Michael Peeters is Program Director Connectivity+Humanized Technology at imec. Michael has been identifying and implementing state-of-the art technology opportunities in telecommunications through a career that spans two decades.
Both as Head of the Nokia Incubator and the Innovation Portfolio at Nokia, as well as CTO for the Wireless Division at Alcatel-Lucent, his role required him to make sense out of the uncertainty that exists when technological possibilities have to be balanced with business case realities. His team’s responsibility: to see beyond the business analysis and help customers envision how emerging technologies and trends, such as 5G and AI, will impact their networks and end-user community.
Prior to his role as CTO for the Wireless Division, he was CTO for the Wireline Division. The team looked beyond the product roadmap and identified what new trends, technologies and tools were on the horizon and determined how those future opportunities fit into the Alcatel-Lucent pipeline. It was also during this period that the business commercialized VDSL2 Vectoring, an idea conceived 7 years earlier while leading the Bell Labs Access Nodes and DSL Technology department.
He has authored more than 100 peer-reviewed publications, many white papers and holds patents in the access and photonics domains. Michael earned a Ph.D. in Applied Physics and Photonics from Vrije Universiteit Brussel as well as a master’s degree in Electrotechnical Engineering.
Outside of work, Michael is passionate about cooking and continues to refine the recipe for the perfect lasagna, balanced by bouts of long-distance running to offset the caloric intake inherent with such a quest.